Mahalo iā ʻoe no kou kipa ʻana iā Nature.com. ʻO ka polokalamu kele pūnaewele āu e hoʻohana nei he kākoʻo liʻiliʻi no CSS. No ka ʻike maikaʻi loa, paipai mākou iā ʻoe e hoʻohana i kahi polokalamu kele hou (a i ʻole e hoʻopau i ke ʻano hoʻohālikelike ma Internet Explorer).
Hoʻokumu ʻia kahi hana hou e pili ana i ka hoʻoheheʻe laser koho e hoʻomalu i ka microstructure o nā huahana i ke kaʻina hana. Ke hilinaʻi nei ka mīkini i ka hana ʻana o nā hawewe kani ultrasonic kiʻekiʻe i loko o ka wai i hoʻoheheʻe ʻia e ka paʻakikī paʻakikī-modulated laser irradiation. Hōʻike nā haʻawina hoʻokolohua a me nā hoʻohālikelike helu e hiki ke hana ʻenehana a hiki ke hoʻohui maikaʻi ʻia i loko o ka hoʻolālā ʻana o ka mīkini laser melting hou.
ʻO ka hana hoʻohui (AM) o nā ʻāpana paʻakikī ua ulu nui i nā makahiki i hala iho nei. nā gradients, kiʻekiʻe ka hoʻoluʻu ʻana, a me ka paʻakikī o nā pōʻai wela i ka hoʻoheheʻe ʻana a me ka hoʻoheheʻe ʻana i ka mea 11, e alakaʻi i ka ulu ʻana o ka palaoa epitaxial a me ka porosity nui. 12,13 ua hōʻike i ka pono e hoʻomalu i ka wela wela, nā helu hoʻoluʻu, a me ka hui pū ʻana, a i ʻole e hoʻopili i nā haʻalulu kino e nā kahua o waho o nā waiwai like ʻole, e like me ka ultrasound, e hoʻokō ai i nā hale palaoa equiaxed maikaʻi.
Nui nā puke e pili ana i ka hopena o ka vibration lapaʻau ma ke kaʻina hana paʻa i nā kaʻina hoʻolei maʻamau 14,15. Akā naʻe, ʻo ka hoʻohana ʻana i kahi kahua waho i ka hoʻoheheʻe nui ʻaʻole e hana i ka microstructure mea makemake. fields16,17,18,19,20,21,22,23,24,25,26,27, arc stirring28 and oscillation29, electromagnetic effects during pulsed plasma arcs30,31 and other ways32 have been considered .Attach to the substrate using an external high-intensity grain kHz source. i hoʻohui ʻia i ka hoʻonui ʻia ʻana o ka constitutive subcooling zone ma muli o ka emi ʻana o ka mahana wela a me ka hoʻonui ʻana i ka ultrasound e hana i nā crystallites hou ma o ka cavitation.
I loko o kēia hana, ua noiʻi mākou i ka hiki ke hoʻololi i ke ʻano o ka ʻano o ka austenitic stainless steels ma ka sonicating i ka loko i hoʻoheheʻe ʻia me nā hawewe kani i hana ʻia e ka laser hehee iho. Ua hana ʻia kēia hana ma luna o nā papa kila kila nona nā ʻili i hōʻike ʻia i ka radiation laser modulated intensity.
ʻOiai ma ka ultrasonic horn-based ultrasonic therapy, ua māhele ʻia ka ikaika kani ultrasonic o ka hawewe kani kū i loko o ka ʻāpana, ʻoiai ʻo ka ikaika ultrasonic i hoʻokomo ʻia i ka laser e hoʻopaʻa nui ʻia ma kahi kokoke i kahi e komo ai ka radiation laser. ua kokoke i ka 'ole a me ka velocity mea liilii i ka amplitude kiʻekiʻe ma luna o ka ili luna holoʻokoʻa o ka part.The kani puʻe i loko o ka holoʻokoʻa hoʻoheheʻe waiʻaʻole hiki ke oi aku ma mua o 0.1% o ka kiekie puʻe hanaia e ka welding poo, no ka mea, o ka hawewe o ka ultrasonic nä hawewe me ka pinepine o 20 kHz i kuhiliʻole kila he \(\ sim 0.3~\ kikokikona {m}th\), a me ka maʻamau o ka de. {mm}\).No laila, liʻiliʻi paha ka hopena o ka ultrasound ma ka cavitation.
Pono e hoʻomaopopo ʻia ʻo ka hoʻohana ʻana i ka radiation laser i hoʻololi ʻia i ka hoʻopaʻa ʻana i ka metala laser he wahi ikaika o ka noiʻi35,36,37,38.
ʻO nā hopena wela o ka hoʻoheheʻe ʻia ʻana o ka laser ma ka waena ke kumu no ka aneane pau ʻana i nā ʻenehana laser 39, 40, e like me ke ʻoki ʻana i ka 41, ka hoʻoheheʻe ʻana, ka paʻakikī, ka wili ʻana 42, ka hoʻomaʻemaʻe ʻili, ka hui ʻana o ka ʻili, ka polishing 43, etc.
Pono e hoʻomaopopo ʻia ʻo kēlā me kēia hana non-stationary ma ke kikowaena, me ka hana lasing ma ka mea hoʻoheheʻe ʻana, e hopena i ka hauʻoli o nā hawewe acoustic i loko o ia me ka ʻoi aʻe a i ʻole ka pono. ʻO nā monographs50, 51, 52 hāʻawi i nā loiloi kumu o kēia kaʻina hana a me kāna mau noi kūpono.
Ua kūkākūkā ʻia kēia mau pilikia ma nā ʻaha kūkā like ʻole, a ua hoʻokumu ʻia ka laser excitation o ka ultrasound i nā noi ʻelua o ka ʻenehana laser53 a me ka lāʻau lapaʻau54. No laila, hiki ke manaʻo ʻia ua hoʻokumu ʻia ka manaʻo kumu o ke kaʻina hana e hana ai nā kukui laser pulsed ma kahi mea absorbing.
ʻO ka hopena o nā hawewe haʻalulu i hana ʻia e ka laser ke kumu o ka laser shock peening57,58,59, ka mea i hoʻohana ʻia no ka mālama ʻana i ka ʻili o nā ʻāpana i hana ʻia i hoʻohui ʻia 60. Eia naʻe, ʻoi aku ka maikaʻi o ka hoʻoikaika ʻana i ka laser ma nā pulses laser nanosecond a me nā wahi i hoʻouka ʻia (e laʻa, me kahi papa wai)59 no ka mea, hoʻonui ka hoʻouka ʻana o ka mīkini.
Ua hana ʻia nā hoʻokolohua no ka noiʻi ʻana i nā hopena hiki ke loaʻa o nā kahua kino like ʻole ma ka microstructure o nā mea paʻa. Splitter plate system.Ma muli o ka hui pū ʻana o nā kānana kūʻokoʻa kūʻokoʻa, ʻokoʻa ka ikehu pulse ma ka pahu hopu mai \ (E_L \ sim 20 ~ \ kikokikona {mJ} \) i \ (E_L \ sim 100 ~ \ kikokikona {mJ} \). Hoʻohana ʻia ka \(1~\text {ms}\)) no ka hoʻoholo ʻana i ka hanana a ʻike ʻia mai ka pahu hopu, a ʻelua mau mika mana (photodiodes me nā manawa pane pōkole \(<10~\text {ns}\)) no ka hoʻoholo ʻana i ka hanana a me ka mana optical. wahi laʻana. E hoʻopololei i ka lāʻau ma luna o ka pahu hopu me ka hoʻohana ʻana i kahi lens (Ka uhi ʻana i ka antireflection ma \(1.06 \upmu \text {m}\), ka lōʻihi kiko \(160~\text {mm}\)) a me ka pūhaka kukuna ma ka ʻili o ka pahu hopu 60– \(100~\upmu\text {m}\).
Kiʻi hoʻolālā hana o ka hoʻonohonoho hoʻokolohua: 1—laser; 2—ke kukui laser; 3— kānana mānoanoa kūʻokoʻa; 4—photodiode i hui pū ʻia; 5—mea hoʻokaʻawale kaola; 6—diaphragm; 7—calorimeter o ka kukuna hanana; 8 - calorimeter o ke kukui i ʻike ʻia; 9 - mika mana kukuna hanana; 10 - ʻike ʻia ka mika mana kukui; 11 - ka nānā ʻana i ka lens; 12 - aniani; 13 - hāpana; 14 - transducer piezoelectric broadband; 15 - 2D mea hoʻololi; 16 - hoʻonohonoho i ka microcontroller; 17 - hui hoʻonohonoho; 18 - ʻōnaehana kiʻi kikohoʻe lehulehu me nā helu hoʻohālike like ʻole; 19 – kamepiula pilikino.
Hoʻokō ʻia ka mālama ʻana o Ultrasonic e like me kēia. Ke hana nei ka laser ma ke ʻano holo manuahi; No laila, ʻo ka lōʻihi o ka pulse laser he \(\tau _L \sim 150~\upmu \text {s}\), i loaʻa i nā lōʻihi he nui ma kahi o \(1.5~\upmu \text {s } \) kēlā me kēia. ʻO ke kino kino o ka pulse laser a me kona spectrum he haʻahaʻa-frequency enveloppe a me kahi kiʻekiʻe-frequency modulation o ~, me ka awelika o ka \ MHz. Hōʻike 2.- Hāʻawi ka enveloppe alapine i ka hoʻomehana a me ka hoʻoheheʻe ʻana a me ka hoʻoheheʻe ʻana o ka mea, ʻoiai ke hāʻawi nei ka mea alapine kiʻekiʻe i nā vibrations ultrasonic ma muli o ka hopena photoacoustic. Mai ka \(7~\text {kHz}\) a i ka \ (2~\text {MHz}\), a o ke alapine waena he \(~ 0.7~\text {MHz}\) ). ʻO nā pulses ka mea maʻamau o ka laser mode holo manuahi.
ʻO ka māhele manawa o ka laser pulse ikaika (a) a me ke kani velocity (b) ma ka ʻaoʻao hope o ka hāpana, ka spectra (blue curve) o ka pulse laser hoʻokahi (c) a me ka pulse ultrasound (d) awelika ma luna o 300 laser pulses (ʻulaʻula ʻulaʻula).
Hiki iā mākou ke hoʻokaʻawale i nā ʻāpana haʻahaʻa haʻahaʻa a me nā ʻāpana kiʻekiʻe o ka hoʻomaʻamaʻa acoustic e pili ana i ka envelop haʻahaʻa haʻahaʻa o ka pulse laser a me ka modulation kiʻekiʻe. no laila, ua manaʻo ʻia ka hopena nui o nā ʻāpana ākea kiʻekiʻe o ka hōʻailona acoustic ma ka microstructure.
He paʻakikī nā kaʻina hana kino i ka SLM a hiki i ka manawa like ma nā unahi spatial a me ke kino.
ʻO ka helu ʻana a me ka hoʻoluʻu ʻana a hiki i \(10^6~\text {K}/\text {s}\) /\text{ ma muli o ka hoʻomālamalama laser kūloko me nā mānoanoa mana a hiki i \(10^{13}~\text {W} cm}^2\).
ʻO ka pōʻai hoʻoheheʻe-paʻa ka lōʻihi ma waena o 1 a me \(10~\text {ms}\), e kōkua ana i ka hoʻopaʻa paʻa wikiwiki ʻana o ka wahi hoʻoheheʻe i ka wā hoʻoluʻu.
ʻO ka hoʻomehana wikiwiki ʻana o ka ʻili hāpana i ka hoʻokumu ʻia ʻana o nā koʻikoʻi thermoelastic kiʻekiʻe i ka papa o ka ʻili. ʻO nā hawewe kani kani ultrasonic e hoʻolaha ana mai ka ʻili a hiki i ka substrate. No ka loaʻa ʻana o ka ʻikepili quantitative pololei ma ke koʻikoʻi kūloko a me ka puʻunaue ʻana, ua hana ʻia kahi hoʻohālikelike mesoscopic o ka pilikia elastic deformation conjugated i ka wela a me ka hoʻoili nuipaʻa.
ʻO nā hoʻohālikelike hoʻomalu o ke kŘkohu he (1) hoʻololi wela paʻa ʻole kahi e hilinaʻi ai ka thermal conductivity i ke kūlana o ka pae (powder, melt, polycrystalline) a me ka mahana, (2) fluctuations in elastic deformation after continuum ablation and thermoelastic expansion equation. The boundary value problem is determined on experimental conditions.The modulated cool heat sample surface is. flux.Ho'ākāka 'ia ka nuipa ma muli o ka helu 'ana o ka saturated vapor pressure o ka evaporating material.The elastoplastic stress-strain relationship is proportional where the thermoelastic stress is proportional to the temperature oko'a. ke anawaena kaola pono.
Hōʻike ka Figure 3 i nā hopena o ka hoʻohālikelike helu o ka ʻāpana hoʻoheheʻe me ka hoʻohana ʻana i ke kumu hoʻohālike makemakika macroscopic. ʻO ke anawaena o ka fusion zone ʻo \(200~\upmu \text {m}\) (\(100~\upmu \text {m}\) radius) a me \(40~\upmu \text {m}\) e like me ka hōʻike ʻana i ka hohonu o ka manawa ma ke ʻano o ka wela o ka ʻāina. \(100~\text {K}\) ma muli o ke ki'eki'e intermittent factor o ka pulse modulation.The heating \(V_h\) and cooling \(V_c\) rate are on the order of \(10^7\) and \(10^6~\text {K}/\text {s}\), each.These values ​​​​mea 's in good agreement with our order of ma'i 64. a me \(V_c\) ka hopena o ka wela nui loa o ka papa ili, kahi i lawa ole ai ka wela o ka ili i ka substrate no ka wehe ana i ka wela. No laila, ma \(t=26~\upmu \text {s}\) hiki ke pi'i ka wela o ka ili e like me \(4800~\text {K}\).
Nā hualoaʻa simulation helu o ka heheʻe wahi o ka hookahi laser pulse annealing ma 316L hāpana pā. ʻO ka manawa mai ka hoʻomaka o ka pulse a hiki i ka hohonu o ka punawai hoohehee a hiki i ka waiwai nui o \(180~\upmu\text {s}\).The isotherm\(T = T_L = 1723~\text {K}\) e hoike ana i ka wai laina a me ka paa paa. i ke koʻikoʻi hua i helu ʻia ma ke ʻano he hana o ka mahana ma ka ʻāpana aʻe. No laila, ma ka domain ma waena o nā isoline ʻelua (isotherms \ (T = T_L \) a me isobars \ (\ sigma = \ sigma _V (T) \)), ua hoʻokau ʻia ka paʻa paʻa i nā haʻalulu mechanical ikaika, hiki ke alakaʻi i nā loli i ka microstructure.
Ua wehewehe hou ʻia kēia hopena ma ka Figure 4a, kahi i hoʻolālā ʻia ai ke kiʻekiʻe o ke kaomi i loko o ka ʻāpana i hoʻoheheʻe ʻia ma ke ʻano he hana o ka manawa a me ka mamao mai ka ʻili. ʻO ke kaomi kūloko ma ka wahi hoʻomalu ua like nā ʻano oscillation e like me ke alapine o \(500~\text {kHz}\).ʻO ia hoʻi, ua hoʻokumu ʻia nā hawewe kani ultrasonic ma ka ʻili a laila hoʻolaha i loko o ka substrate.
Hōʻike ʻia nā hiʻohiʻona i helu ʻia o ka ʻāpana deformation kokoke i ka ʻāpana heheʻe. modulation like me ke kaomi ili. Loaʻa kēia koʻikoʻi ma muli o ka laser ablation, ʻaʻole i ʻike ʻia ke koʻikoʻi thermoelastic ma nā wahi mana no ka mea liʻiliʻi loa ka wahi i hoʻopili ʻia me ka wela.
Loaʻa ka hopena koʻikoʻi o nā pae koʻikoʻi modulated i ka pilina paʻa-wai a ʻo ia paha ke ʻano mana e hoʻoponopono ai i ke ala paʻa. anawaena ma waena o 300 a me \(800~\upmu \text {m}\) ma muli o ka manawa koke.
No laila, ʻo ka modulation paʻakikī o ka pulsed laser annealing e alakaʻi i ka hopena ultrasonic. He ʻokoʻa ke ala koho microstructure ke hoʻohālikelike ʻia me ka SLM me ka loaʻa ʻole o ka ultrasonic. loaʻa nā hopena e hāʻawi i ka hiki ke hoʻolālā i ka pulse modulation-induced ultrasound-driven SLM prototype. I kēia hihia, hiki ke hoʻokuʻu ʻia ka piezoelectric inductor 26 i hoʻohana ʻia ma nā wahi ʻē aʻe.
(a) Pumi ma ke ano he hana o ka manawa, i heluia ma na mamao like ole mai ka ili 0, 20 a me \(40~\upmu \text {m}\) ma ke axis of symmetry.(b) Kaumaha Von Mises pili i ka manawa i heluia i loko o ka matrix pa'a ma ka mamao 70, 120 a me \(170~\upmu \text {m}\) mai ka la'ana ili.
Ua hana ʻia nā hoʻokolohua ma luna o nā pā kila kila AISI 321H me nā ana \(20\times 20\times 5~\text {mm}\). induce remelting o ka mea i hanaia no ka palaoa refinement.I na mea a pau, ka remelted zone ua sonicated, ma muli o ka oscillatory māhele o ka laser radiation.This hualoaʻa ma ka oi aku ma mua o 5-fold ka ho'ēmi 'ana i ka awelika wahi palaoa.
Nā ʻāpana liʻiliʻi (a,d,g,j) a me (b,e,h,k) - microstructure o nā ʻāpana hoʻoheheʻe laser, nā subplots (c,f,i,l) - ka māhele ʻāpana o nā hua kala. Hōʻike ka malu i nā ʻāpana i hoʻohana ʻia no ka helu ʻana i ka histogram. Ua pili nā kala me nā ʻāpana palaoa (e ʻike i ka pahu kala ma ka piko o ka histogram. ʻO nā subplots (ac) pili i ke kila kila kila ʻole, a me nā subplots (df), (gi), (jl) e pili ana i nā remelts 1, 3 a me 5.
No ka mea, ʻaʻole e loli ka ikaika o ka pulse laser ma waena o nā hala ma hope, ua like ka hohonu o ka wahi i hoʻoheheʻe ʻia. No laila, "uhi" ke kahawai ma hope i ka mea ma mua.
ʻO ka hoʻomaʻamaʻa ʻana i ka palaoa ma muli o ka hoʻomaloʻo wikiwiki ʻana o ka wai hoʻoheheʻe ʻia. Nd: YAG laser ma ke ʻano holo manuahi. Akā naʻe, ua ʻike ʻia kahi ʻano kolamu maʻamau.
ʻO ka microstructure o ka māhele hoʻoheheʻe laser o kahi laser nalu mau (300 W ka mana mau, 200 mm/s scan wikiwiki, AISI 321H kila kila).
(a) Microstructure a me (b) electron backscatter diffraction kiʻi o ka laser melting zone o vacuum hoʻomau nalu laser (ka mana mau 100 W, scanning speed 200 mm/s, AISI 316L stainless steel) \ (\ sim 2~\ kikokikona {mbar }\).
No laila, ua hōʻike maopopo ʻia ka paʻakikī modulation o ka laser pulse ikaika i ka hopena koʻikoʻi i ka hopena microstructure.We manaʻoʻiʻo he mechanical kēia hopena ma ke ʻano a loaʻa ma muli o ka hana ʻana o nā haʻalulu kani ultrasonic propagating mai ka irradiated ili o ka hehee hohonu i loko o ka hāpana. ultrasound i loko o nā mea like 'ole e like me Ti-6Al-4V huila 26 a me kuhiliʻole kila 34 ka hopena o.The hiki mechanical ua speculated e like me follows.Intense ultrasound hiki ke kumu acoustic cavitation, e like me ka hoike ana ma ultrafast in situ synchrotron X-ray kiʻi. {MPa}\) 69. Ua lawa paha ka ikaika o ia mau hawewe e hooikaika ai i ke kukulu ana i ka nuclei solid-phase nui ko'iko'i i loko o ka wai nui, e hoopau ana i ke ano o ka palaoa columnar ma'amau o ka hana ana i na mea hoohui.
Maʻaneʻi, ke noi aku nei mākou i kekahi hana ʻē aʻe e pili ana i ka hoʻololi ʻana i ka hoʻololi ʻana e ka sonication ikaika. ʻO ka mea ma hope o ka solidification aia ma kahi wela kiʻekiʻe kokoke i ka helu heheʻe a loaʻa kahi haʻahaʻa haʻahaʻa haʻahaʻa. (E nānā i ka Figure 8). No laila, no ka ho'āʻoʻana i ke kuhiakau, ua hana mākou i ka molecular dynamics (MD) simulations o ka Fe-Cr-Ni haku mele like me AISI 316 L kila i mea e loiloi ai i ka hana koʻikoʻi hua kokoke i ka helu heheʻe. nā helu, ua hoʻohana mākou i ka Embedded Atomic Model (EAM) mai 74.MD simulations i hana ʻia me ka hoʻohana ʻana i nā code LAMMPS 75,76. E paʻi ʻia nā kikoʻī o ka simulation MD ma kahi ʻē.
Hāʻawi i ke koʻikoʻi no ka AISI grade 316 austenitic stainless steel a me ka hoʻokumu ʻana i ke ʻano hoʻohālikelike me ka mahana no nā hoʻohālikelike MD. ʻO nā ana hoʻokolohua mai nā kuhikuhi: (a) 77, (b) 78, (c) 79, (d) 80, (e) 81.e nānā i. (f) 82 he kumu hoʻohālike empirical o ke ana ʻana i ke koʻikoʻi i hoʻohālikelike ʻia i ka wā o ka hoʻoulu ʻana i ke kaumaha-ma ka laser hana hoʻohui. ʻO nā hopena hoʻohālikelike MD nui i loko o kēia haʻawina i kapa ʻia ʻo \(\vartriangleleft\) no kahi aniani ʻole pau ʻole kīnā ʻole a me ka \(\vartriangleright\) no nā ʻōpala palena e noʻonoʻo ana i ka nui o ka palaoa ma o ka Hall-Petch pili Dimensions \(d = 50~\upmu \text {m}\).
Hiki ke ʻike ʻia ma ka \(T>1500~\text {K}\) ke hāʻule iho nei ke koʻikoʻi o ka hua ma lalo o \(40~\text {MPa}\).Ma kekahi ʻaoʻao, wānana nā manaʻo e ʻoi aku ka nui o ka ultrasonic amplitude i hana ʻia e ka laser i \(40~\text {MPa}\) (e nānā i ka Fig.
ʻO ka hoʻokumu ʻana o ka microstructure o 12Cr18Ni10Ti (AISI 321H) austenitic stainless steel i ka wā SLM ua hoʻāʻo ʻia me ka hoʻohana ʻana i kahi kumu laser pulsed paʻakikī.
Ua ʻike ʻia ka hōʻemi ʻana o ka nui o ka palaoa i ka wahi hoʻoheheʻe laser ma muli o ka hoʻoheheʻe ʻana o ka laser ma hope o 1, 3 a i ʻole 5 mau hala.
Hōʻike ka hoʻohālike macroscopic i ka nui i manaʻo ʻia o ka ʻāina kahi e hoʻopilikia maikaʻi ai ka hoʻololi ʻana o ke kani ultrasonic i ka mua solidification a hiki i \(1~\text {mm}\).
Hōʻike ke kumu hoʻohālike microscopic MD i ka hoʻemi nui ʻana o ka ikaika hua o AISI 316 austenitic stainless steel i \(40~\text {MPa}\) kokoke i ka helu heheʻe.
Hōʻike nā hopena i loaʻa i kahi ala no ka hoʻomalu ʻana i ka microstructure o nā mea me ka hoʻohana ʻana i ka hoʻoili laser modulated paʻakikī a hiki ke lilo i kumu no ka hana ʻana i nā hoʻololi hou o ka ʻenehana SLM pulsed.
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Azarniya, A. et al.Additive manufacturing o Ti-6Al-4V hapa e ka laser metala deposition (LMD): kaʻina hana, microstructure a me mechanical properties.J. Alloys.compound.804, 163–191.https://doi.org/10.1016/j.jallcom.2019.04.255 (2019).
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Tan, X. a me ka.